Call for Participation: PackagingCon 2023, 26-28 October, Berlin & Online

PackagingCon 2023

  • 26-28th October
  • Berlin and online
  • Submission deadline: 31st July
  • Early registration ends: 8th September

PackagingCon 2023 will bring together different software packaging ecosystems to share best practices and discuss common challenges in software packaging. From Python’s pip to Rust’s cargo to Julia’s Pkg, from Debian apt over Nix, to conda and mamba, and from vcpkg to Spack. The 2021 conference drew 350+ participants and featured over 60 presentations.

Call for Submissions

This conference is for developers of software package management tools, as well as software packagers and communities. Package management helps tame software complexity and establish and maintain software supply chain security. This is a challenging domain that embraces a diverse set of solutions. If you work in software package management then please share your work at PackagingCon! The call for submissions closes 31st July. Topics from the most focused technical questions to community engagement are welcome.

Register Now

Early registration starts at €37.50 for virtual, and €150 for in person. Significant discounts are available for early registration, students, and those paying out of their own funds. Early registration ends 8th September.

Seeking Conference Sponsors

PackagingCon 2023 is a rare opportunity for your organization to support and reach the core decision makers and power users of software packaging across all languages and operating systems. Multiple sponsorship levels are available to suit your budget and goals. Please join sponsors such as Quansight and Anaconda to help make PackagingCon 2023 possible and affordable.

We hope to see you in October, and your presentation proposals this month!


PackagingCon unfortunately clashes with PyCon APAC this year and I’m choosing to attend the latter, being a Python user based in Asia. I attended the online-only edition in 2021 and found the conference quite wonderful, however. It’s a very good chance to see ecosystems of a wide variaty have differences on many topics, and help you look things from different angles even if you are not particularly involved in packaging tooling, since you need to deal with some kind of development workflow problems eventually, and other people’s experience is the best resource you can have. I hope for a nice turnout and wish everyone attending a good time.


Update: PackagingCon submission deadline extended to the the end of Sunday August 6, anywhere on Earth.